DEK Exhibits Electronics Manufacturing Equipment

DEK is presenting technologies from print platforms through to next-generation stencil technologies at this year's SMT/Hybrid/Packaging exhibition, which is being held in Nuremberg from 8-10 June. Taking centre stage on DEK Stand 7-305 are the Horizon 01iX and Horizon 03iX print platforms, complete with enhanced quick-access cover packages designed to improve usability and operator management. Fast changeover and Six Sigma performance feature on all of the Horizon iX models, with platforms designed for scalability and in-field upgradeability.

Customers can determine the Horizon model that best suits their manufacturing requirements, with the option to add features such as ultra-fast under-stencil cleaning, automatic board support or dispense capability if and when manufacturing requires. Visitors can also see the Horizon 01iX on the Fraunhofer Institute's live production line running in Hall 6, Stand 430. Demonstrating the latest production techniques, the platform will utilise advanced technologies including Vectorguard stencils, Over Top Snuggers substrate clamping, HD Grid-Lok high-density automatic tooling, Cyclone understencil cleaning, Hawkeye print verification and the next-generation Instinctiv V9 user interface.

Visitors to SMT/Hybrid/Packaging will be able to view DEK's Sentinel platform, a print verification and process management technology that can lower the cost of printed boards. Combining automatic verification, traceability, real-time process management and inspection capabilities to safeguard and increase productivity at the print platform, Sentinel is designed to ensure even greater numbers of qualified good boards per hour moving to downstream assembly processes. Based on DEK's Hawkeye post-print inspection tool, Sentinel delivers 100 per cent inspection capability at the line beat rate and offers high-speed paste on pad, bridge detection and alignment capabilities.

Also on Stand 7-305, DEK productivity tools on show will include Stinger on-board dispensing technology and Over Top Snuggers substrate clamping technology. The DEK team will also highlight its latest stencil technology, Vectorguard Double Layer Platinum. Utilising DEK Vectorguard stencil tensioning, Vectorguard Double Layer Platinum enables fine line printing at less than two mils or 50 microns to deliver a technology that is said to be more effective than traditional screens for applications such as low-temperature co-fired ceramic (LTCC) and microelectronic packaging.

SMT Nuremberg visitors will also be able to witness a live demonstration of DEK's process improvement products. A dedicated on-stand laboratory will put a wide range of under-stencil cleaning rolls and under-stencil cleaning agents to the test, highlighting how DEK technologies can boost productivity and yield, reduce risk of defects and minimise rework.

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