Devices Provide Ultra-Low-Profile Board Mounting

Toshiba Electronics Europe (TEE) has released two photocoupler devices that offer ultra-low-profile board mounting in applications requiring isolated switching to international safety standards. The TLP109 and TLP116A are small-outline 'mini-flat' photocouplers supplied in an SO6 surface-mount package. This package, which has a board-mounting footprint of 4.4 x 3.6mm, is pin-compatible with conventional MFSOP6 packages. However, at just 2.3mm, the package is 0.5mm thinner.

Each of the new devices consists of a GaAlAs infrared LED optically coupled to a high-gain, high-speed photodetector. Both couplers offer reinforced insulation through clearance and creepage distances of more than 5mm. Isolation voltage is rated at 3750Vrms, while an internal Faraday shield with a thickness of more than 0.4mm ensures a guaranteed common-mode transient immunity of +/-10kV/us. Providing a general-purpose open-collector output, the TLP109 has a maximum VCC voltage rating of 30V and a typical data-transfer rate of 1Mbps.

As a result, the photocoupler is ideal for digital logic isolation, line receivers, power-supply feedback control, transistor inverters and switching power supplies. The TLP116A operates from 4.5 to 5.5V and features a high-speed totem-pole output delivering typical data-transfer rates of 20Mbps. This coupler is particularly suited to high-speed interfaces, factory-automation systems and plasma-display panels (PDPs).

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