Thermal-Clad HPL Simplifies Design And Assembly

Bergquist's HPL dielectric for thermal-clad substrates is optimised for high-power LED lighting and other applications requiring enhanced heat-transfer efficiency. It enables lower operating temperatures, higher LED driving-currents and reduced component count, resulting in simplified design and assembly. The new dielectric has a high thermal conductivity of 3.0W/m-K, resulting in a low thermal resistance of only 0.13Ccm2/W.

The dielectric thickness is 38um and is available on all Bergquist Thermal Clad aluminium and copper insulated metal substrates (IMS). Displaying superior thermal performance compared with standard FR4 PCBs, Thermal Clad HPL is supplied as scored-array circuits, scored singulated circuits or punched singulated parts. By efficiently removing heat generated from surface-mounted high-power LEDs, Thermal Clad HPL promotes reliability by minimising the operating temperature for a given LED driving current.

Engineers thus gain extra freedom to optimise light output, component count and lumen maintenance in equipment such as energy-saving lamps, LED-based bulb replacements, signage, stage lighting and display backlights. With a maximum operating temperature of 150C and continuous operating voltage of 170V DC (120V AC), the new dielectric can be used in a variety of environments and applications.

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